Workpackages
WP1: Nanometrology for new materials
WP leader: PTB
Other participants: BAM, LNE, PTB, CNRS, ELECTROSCIENCES LIMITED, UNIVERSITY OF LIVERPOOL, METAS
Objective: The aim of this work package is to develop complementary nano-metrologies adapted to the new class of materials proposed for the next generation of ultra-low power energy-efficient devices.
Structure
- Task 1.1: Impedance metrology on energy materials at the nanoscale
- Task 1.2: Analytical in-situ x-ray nanometrology
- Task 1.3: Mesoscale characterisation studies for in-situ nanometrology
WP2: Multi-physics Characterisation of RF components
WP leader: NPL
Other participants: CMI, LNE, NPL, UNIVERSITY OF SURREY, UNIVERSITY OF LIVERPOOL, UNIVERSITAT POLITÈCNICA DE CATALUNYA, METAS
Objective: The aim of this work package is to develop frequency- and time-domain techniques for the simultaneous measurement of dynamic thermal profiles, electromagnetic field sensing, DC electrical power consumption and RF operating waveforms for a wide range of electronic components (operating in-situ, under realistic conditions).
Structure
- Task 2.1: Scanning probe techniques
- Task 2.2: Electrical contacting measurement techniques
- Task 2.3: Integrated multi-physics characterisations
- Task 2.4: Measurement errors and uncertainty
WP3: Power Consumption measurement of wireless systems
WP leader: LNE
Other participants: JV, LNE, UNIVERSITY OF SURREY, UNIVERSITY OF LILLE 1, UNIVERSITÉ PARIS-EST MARNE-LA-VALLÉE
Objective: The aim of this work package is to develop embedded sensors and the associated calibration and measurement techniques to accurately measure power consumption of wireless systems (mobile phones, tablets and connected devices) and to improve the effectiveness of analogue and RF tests of components and systems.
Structure
- Task 3.1: Development of calibration techniques for power sensors: on-chip and lab level
- Task 3.2: Design and modelling of the embedded microwave sensors on Silicon technologies
- Task 3.3: Characterisation of the embedded microwave sensors on Silicon technologies
- Task 3.4: Non-intrusive techniques for the characterisation of PCB consumption
WP4: Creating impact
WP leader: NPL
Other participants: BAM, CMI, JV, LNE, NPL, PTB, CNRS, ELECTROSCIENCES LIMITED, UNIVERSITY OF SURREY, UNIVERSITY OF LIVERPOOL, UNIVERSITY OF LILLE 1, UNIVERSITAT POLITÈCNICA DE CATALUNYA, UNIVERSITÉ PARIS-EST MARNE-LA-VALLÉE, METAS
Objective: The aim is to maximise the impact of this project within the European community of stakeholders and industrial end-users, including those within other EURAMET countries outside EMPIR. This will ensure that this project achieves the highest possible impact on the European region.
Structure
- Task 4.1 Knowledge transfer
- Task 4.2: Training
- Task 4.3: Uptake and exploitation
WP5: Management and coordination
WP leader: LNE
Other participants: BAM, CMI, JV, LNE, NPL, PTB, CNRS, ELECTROSCIENCES LIMITED, UNIVERSITY OF SURREY, UNIVERSITY OF LIVERPOOL, UNIVERSITY OF LILLE 1, UNIVERSITAT POLITÈCNICA DE CATALUNYA, UNIVERSITÉ PARIS-EST MARNE-LA-VALLÉE, METAS
Structure
- Task 5.1: Project management
- Task 5.2: Project meetings
- Task 5.3: Project reporting